High-performance computing (HPC) is key to solving large complex problems in science, engineering and business environments.
It requires a significant increase in rack density when compared to business-as-usual servers.
HPC is usually cooled through non-conventional means as it surpasses the effective cooling limit of the traditional underfloor DX airflow distribution.
It is commonly cooled through the use of rear door heat exchangers (RDHX) although there are many “alternative” solutions.
Some new HPC equipment is cooled via liquid to chip systems which distribute water to a heatsink installed directly onto the CPUs.
Total immersion solutions are a growing trend with many companies beginning to offer their own variants.
Deployment and integration of complete high performance computing facilities
Solutions to suit different servers
Guarantee that each solution meets the IT infrastructure requirement
Energy efficient cooling solutions for high density server deployments
Effective and resilient power distribution
Cooling solutions to grow with a company's HPC requirements and future expansion
Cooling to suit differing rack densities from 10 to 25kW and 22kW to 65kW
In-rack and on-rack cooling
Partnership with Iceotope whose technology allows for efficient cooling and total heat reclaim
Reusing heat from IT equipment for other applications
