High-performance computing (HPC) is key to solving large complex problems in science, engineering and business environments.
By enabling researchers and scientists to tackle complex problems, they are able to push the boundaries of what is possible, ultimately leading to new discoveries and accelerating technological advancements.
However, HPC data centres require a significant increase in rack density compared to business-as-usual servers.
HPC is usually cooled through non-conventional means as it surpasses the practical cooling limit of the traditional underfloor DX airflow distribution.
It is commonly cooled through the use of rear door heat exchangers (RDHX) although there are many “alternative” solutions.
Some new HPC equipment is cooled via liquid-to-chip systems which distribute water to a heatsink installed directly onto the CPUs.
Total immersion solutions are a growing trend with many companies beginning to offer their own variants.
HPC data centres are usually designed with scalability in mind. This means they can easily scale up or down based on the computational needs, ensuring that the system can handle varying workloads effectively and efficiently.
Organisations that use HPC data centres will often gain a competitive edge by accelerating research, product development, and decision-making processes. They can bring products to market faster and maintain a leadership position within their industry.
These environments also encourage collaboration and resource sharing among researchers and institutions, particularly in the higher education sector. This is because they can collectively pool their computational resources, expertise, and data to tackle larger and more complex challenges.
Deployment and integration of complete high performance computing facilities
Solutions to suit different servers
Guarantee that each solution meets the IT infrastructure requirement
Energy efficient cooling solutions for high density server deployments
Effective and resilient power distribution
Cooling solutions to grow with a company's HPC requirements and future expansion
Cooling to suit differing rack densities from 10 to 25kW and 22kW to 65kW
In-rack and on-rack cooling
Partnership with Iceotope whose technology allows for efficient cooling and total heat reclaim
Reusing heat from IT equipment for other applications